FRONTIER_DECODED//
The heat behind compute.
Gigawatts, cooling, and the grid powering AI - from the plant to the chip.
300kW+ NEXT-GEN RACK DENSITY
90% OF POWER FROM STEAM TURBINES
2032 SOLAR BECOMES #1 (PROJECTED)
COOLING TECH // DENSITY
Traditional Air - under 20kW/rack - legacy servers
Rear-Door Heat Exchangers - 20-50kW - retrofits
Direct-to-Chip liquid - 50-150kW - AI training clusters
Full Immersion - 150kW+ - high-density HPC
Microfluidic on-chip - 300kW+ - 3D-stacked accelerators
EFFICIENCY METRICS
PUE total facility power vs IT power
WUE annual water vs IT energy
TUE grid-to-chip efficiency
GRID TIMELINE
1882 first grid
1890s AC revolution
2010 smart-grid era
2026 solar peaks + SMRs scale
2035 3.8TW battery storage