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The heat behind compute.

Gigawatts, cooling, and the grid powering AI - from the plant to the chip.

300kW+ NEXT-GEN RACK DENSITY
90% OF POWER FROM STEAM TURBINES
2032 SOLAR BECOMES #1 (PROJECTED)

COOLING TECH // DENSITY

Traditional Air - under 20kW/rack - legacy servers

Rear-Door Heat Exchangers - 20-50kW - retrofits

Direct-to-Chip liquid - 50-150kW - AI training clusters

Full Immersion - 150kW+ - high-density HPC

Microfluidic on-chip - 300kW+ - 3D-stacked accelerators

EFFICIENCY METRICS

PUE total facility power vs IT power

WUE annual water vs IT energy

TUE grid-to-chip efficiency

GRID TIMELINE

1882 first grid

1890s AC revolution

2010 smart-grid era

2026 solar peaks + SMRs scale

2035 3.8TW battery storage

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